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DISCRETE SEMICONDUCTORS
DATA SHEET
BCX17; BCX18 PNP general purpose transistors
Product data sheet Supersedes data of 1999 May 31 2004 Jan 16
NXP Semiconductors
Product data sheet
PNP general purpose transistors
FEATURES * High current (max. 500 mA) * Low voltage (max. 45 V). APPLICATIONS * Saturated switching and driver applications e.g. for industrial service * Thick and thin-film circuits. DESCRIPTION PNP transistor in a SOT23 plastic package. NPN complement: BCX19. PINNING PIN 1 2 3 base emitter collector
BCX17; BCX18
DESCRIPTION
handbook, halfpage
3 3 1
MARKING TYPE NUMBER BCX17 BCX18 Note 1. * = p : Made in Hong Kong. * = t : Made in Malaysia. * = W : Made in China. ORDERING INFORMATION TYPE NUMBER BCX17 BCX18 PACKAGE NAME - DESCRIPTION plastic surface mounted package; 3 leads VERSION SOT23 Fig.1 Simplified outline (SOT23) and symbol. MARKING CODE(1) T1* T2*
Top view
2 1 2
MAM256
2004 Jan 16
2
NXP Semiconductors
Product data sheet
PNP general purpose transistors
LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134). SYMBOL VCBO BCX17 BCX18 VCEO collector-emitter voltage BCX17 BCX18 VEBO IC ICM IBM Ptot Tstg Tj Tamb Note 1. Transistor mounted on an FR4 printed-circuit board. THERMAL CHARACTERISTICS SYMBOL Rth(j-a) Note 1. Transistor mounted on an FR4 printed-circuit board. PARAMETER thermal resistance from junction to ambient CONDITIONS note 1 emitter-base voltage collector current (DC) peak collector current peak base current total power dissipation storage temperature junction temperature operating ambient temperature Tamb 25 C; note 1 open collector open base - - - - - - - -65 - -65 PARAMETER collector-base voltage CONDITIONS open emitter - -
BCX17; BCX18
MIN.
MAX. -50 -30 -45 -25 -5 -500 -1 -200 250 +150 150 +150 V V V V V
UNIT
mA A mA mW C C C
VALUE 500
UNIT K/W
2004 Jan 16
3
NXP Semiconductors
Product data sheet
PNP general purpose transistors
CHARACTERISTICS Tj = 25 C unless otherwise specified. SYMBOL ICBO IEBO hFE PARAMETER collector cut-off current emitter cut-off current DC current gain CONDITIONS IE = 0; VCB = -20 V IE = 0; VCB = -20 V; Tj = 150 C IC = 0; VEB = -5 V IC = -100 mA; VCE = -1 V IC = -300 mA; VCE = -1 V IC = -500 mA; VCE = -1 V VCEsat VBE Cc fT Note 1. VBE decreases by approximately -2 mV/C with increasing temperature. collector-emitter saturation voltage base-emitter voltage collector capacitance transition frequency IC = -500 mA; IB = -50 mA IC = -500 mA; VCE = -1 V; note 1 IE = Ie = 0; VCB = -10 V; f = 1 MHz IC = -10 mA; VCE = -5 V; f = 100 MHz
BCX17; BCX18
MIN. TYP. MAX. UNIT - - - 100 70 40 - - - 80 - - - - - - - - 9 - -100 -5 -100 600 - - -620 -1.2 - - mV V pF MHz nA A nA
2004 Jan 16
4
NXP Semiconductors
Product data sheet
PNP general purpose transistors
PACKAGE OUTLINE
Plastic surface-mounted package; 3 leads
BCX17; BCX18
SOT23
D
B
E
A
X
HE
vMA
3
Q A A1
1
e1 e bp
2
wMB detail X Lp
c
0
1 scale
2 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A 1.1 0.9 A1 max. 0.1 bp 0.48 0.38 c 0.15 0.09 D 3.0 2.8 E 1.4 1.2 e 1.9 e1 0.95 HE 2.5 2.1 Lp 0.45 0.15 Q 0.55 0.45 v 0.2 w 0.1
OUTLINE VERSION SOT23
REFERENCES IEC JEDEC TO-236AB JEITA
EUROPEAN PROJECTION
ISSUE DATE 04-11-04 06-03-16
2004 Jan 16
5
NXP Semiconductors
Product data sheet
PNP general purpose transistors
DATA SHEET STATUS DOCUMENT STATUS(1) Objective data sheet Preliminary data sheet Product data sheet Notes PRODUCT STATUS(2) Development Qualification Production DEFINITION
BCX17; BCX18
This document contains data from the objective specification for product development. This document contains data from the preliminary specification. This document contains the product specification.
1. Please consult the most recently issued document before initiating or completing a design. 2. The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. DISCLAIMERS General Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer's own risk. Applications Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. Quick reference data The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding.
2004 Jan 16
6
NXP Semiconductors
Customer notification This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal definitions and disclaimers. No changes were made to the technical content, except for package outline drawings which were updated to the latest version.
Contact information For additional information please visit: http://www.nxp.com For sales offices addresses send e-mail to: salesaddresses@nxp.com
(c) NXP B.V. 2009 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Printed in The Netherlands R75/04/pp7 Date of release: 2004 Jan 16 Document order number: 9397 750 12406

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